发明名称 |
Halbleiteranordnung bestehend aus einem TAB-Band und deren Herstellungsverfahren |
摘要 |
A semiconductor device comprises a lead frame (53) formed of a conductive material, a semiconductor chip (11) having an electrode (14) on its surface, a first connection section (54) where the lead frame is electrically connected to an electrode on the semiconductor chip by a conductive adhesive; and a second connection section (55) where the lead frame is electrically connected to said electrode on said semiconductor chip by a metal plating to cover the surroundings of said first connection section (54). This structure enhances the connection of the lead frame and the pad electrode of the semiconductor chip. <IMAGE> |
申请公布号 |
DE69132685(T2) |
申请公布日期 |
2002.06.13 |
申请号 |
DE1991632685T |
申请日期 |
1991.05.31 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI |
发明人 |
FUJITSU, TAKAO |
分类号 |
H01L21/60;H01L23/04;H01L23/485;H01L23/495;H01L23/498 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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