| 摘要 |
<p>The invention concerns electrical insulation of assembled chips (2), before being bonded into a single unit (9, 13). It comprises steps which consist in: applying a protective dielectric layer on at least an active surface (6) of a chip (3) of the wafer; placing then fixing on its substrate (8) the chip (3), by bonding its rear surface, a periphery of the protective layer (14) forming a barrier (15); and connecting after protecting, at least a contact pad (10) to the corresponding pad (7). The invention is useful for making portable smart objects, such as chip cards or labels.</p> |
