| 摘要 |
A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with bonding pads, attaching a printed circuit sheet to the pad-mounting surface, forming conductive bonding wires that respectively interconnect the bonding pads and conductive traces on the printed circuit sheet, forming a photoresist layer on the printed surface and the pad-mounting surface, forming access holes in the photoresist layer to expose portions of the conductive traces that are respectively offset from the bonding pads, and forming a plurality of conductive bodies in the access holes such that each of the conductive bodies is electrically connected to a respective one of the bonding pads.
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