| 摘要 |
Known methods for soldering electronic components onto printed boards are often problematic in that solder bridges are likely to be formed after the actual soldering step. So far, these solder bridges have been removed after the soldering step, either by blowing the still liquid solder by means of a gas flow that is directed onto the printed board directly after it is wetted, or, once the solder is solidified, by means of a manual post-treatment. The blowing of the liquid solder on the printed board, however, results in an uncontrolled distribution of the liquid solder on the printed board outside the points of contact provided for. Manual post-treatment is reliable yet very complicated and expensive. The inventive method is characterized in that the solder wave is deformed by way of a gas flow that is directed onto the tearoff edge, that is the line along which the printed board is separated from the solder wave after wetting. The gas flow can have a predetermined flow and temperature profile across the width of the tearoff edge. The inventive method allows for the suppression of the formation of solder bridges. Uncontrolled blowing of the solder on the printed board is no longer required. The profiling of the gas flow allows the provision for different components on the printed board. |
