发明名称 Manufacturing method of semiconductor device
摘要 A capacitor element is formed by setting a contact hole in an interlayer insulating film 3, forming an adhesive film 5 and a lower electrode film 6, forming a capacitor insulating film 7 thereon, crystallizing this capacitor insulating film 7 by applying irradiation of a laser beam, and forming an upper electrode film. This capacitor element brings out characteristics of the metal oxide material to the utmost limit without diminishing the reliability of the element; or, this capacitor film performs a sufficiently high permittivity and a sufficiently high conductivity.
申请公布号 US2002072191(A1) 申请公布日期 2002.06.13
申请号 US20010992027 申请日期 2001.11.26
申请人 NEC CORPORATION 发明人 AOKI HIDEMITSU;FUJIOKA HIROFUMI
分类号 H01L21/316;H01L21/02;H01L21/314;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L21/20;H01L21/824 主分类号 H01L21/316
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