| 摘要 |
Oppositely arranged bumps (82,84) are electrically connected by connecting two IC chips (76,78) through an anisotropic conductor (80) to form an IC chip module (74). With IC chip module (74) having such structure, two IC chips (76,78) provided with functions of a processing portion and an antenna are simply stacked to provide a function for communication, and arrangement of interconnection outside IC chip (76,78) is not necessary. Thus, accidental breakage of the interconnection is avoided and assembly is extremely facilitated. Therefore, a circuit chip mounted card with higher reliability and reduced manufacturing cost and the like can be provided.
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