发明名称 |
MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM, FILM FOR TAB, AND PREPREG |
摘要 |
<p>A material for insulating substrates which is excellent in mechanical properties, dimensional stability, heat resistance, flame retardancy, etc. and, in particular, produces an excellent flame-retardant effect due to the effect of shape retention during combustion. The material for use in producing insulating substrates comprises 100 parts by weight of a thermoplastic resin or a mixture thereof with a thermosetting resin and 0.1 to 100 parts by weight of a phyllosilicate.</p> |
申请公布号 |
CA2429683(A1) |
申请公布日期 |
2002.06.13 |
申请号 |
CA20012429683 |
申请日期 |
2001.12.10 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
FUSHIMI, MASAO;SHIBAYAMA, KOICHI;YAGI, MOTOHIRO;TAKAHASHI, HIDEYUKI;TANIGUCHI, KOJI;YONEZAWA, KOJI |
分类号 |
B32B15/08;C08K3/34;C08K7/00;H01B3/30;H01L23/14;H05K1/03;(IPC1-7):C08L101/00;H01B3/00;C08J5/00;B32B27/20;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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