发明名称 |
Apparatus for removing wafer ring tape |
摘要 |
An apparatus for removing a wafer ring tape, on which defective chips remain, from a wafer ring after normal chips are detached from the wafer ring tape, is provided. The apparatus comprises a ring table for supporting a tape-adhered wafer ring in which the wafer ring tape is attached to the wafer ring; a detaching head positionable above the ring table and movable for detaching the wafer ring tape from the wafer ring; a blocking pin disposed under the ring table to support the wafer ring tape detached from the wafer ring; and a pair of compressing plates disposed under the ring table to compress the wafer ring tape supported by the blocking pin.
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申请公布号 |
US2002070302(A1) |
申请公布日期 |
2002.06.13 |
申请号 |
US20010008703 |
申请日期 |
2001.12.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
GOH SEOK |
分类号 |
H01L21/02;H01L21/00;(IPC1-7):B02C19/00 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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