SEMICONDUCTIVE RESION COMPOSITION AND SEMICONDUCTIVE MEMBER

摘要

A semiconductive resin composition comprises (A) an oxyalkylene polymer having one or more hydrosilylizable alkenyl groups in each molecule, (B) a compound having two or more hydrosilyl groups in each molecule, (C) a hydrosilylizing catalyst, and (D) an ionic conductivity imparting agent or (E) a nonionic surfactant. A semiconductive member having a resistance little varying because of environment and applied voltage and little varying after continuous use, and preferably used as an electrophotographic member, comprising a metallic support member, a semiconductive elastic layer formed on the outer peripheral surface of the metallic support member, and one or more surface layers formed on the semiconductive elastic layer. The semiconductive member has a specific resistance and a specific resistance ratio.