发明名称 Cerium Oxide abrasive and method of polishing substrates
摘要 A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
申请公布号 US2002069593(A1) 申请公布日期 2002.06.13
申请号 US20010782241 申请日期 2001.02.13
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 YOSHIDA MASATO;ASHIZAWA TORANOSUKE;TERAZAKI HIROKI;KURATA YASUSHI;MATSUZAWA JUN;TANNO KIYOHITO;OOTUKI YUUTO
分类号 B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;H01L21/321;(IPC1-7):C09C1/68 主分类号 B24B37/00
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