| 摘要 |
<p>A multi-layer circuit board producing method comprising a hole-forming step in which a sheet-like board material (1) is formed with through or non-through holes and a filling step in which the through or non-through holes (3) formed in the hole- forming step are filled with a paste (7) by use of a filling means, wherein in the filling step, the paste is supplemented with a second paste (11) for supplementary purposes by using a paste supplementing means, whereby the viscosity of the paste is stabilized to improve the fillability of paste into the through or non-through holes.</p> |
