发明名称 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION
摘要 <p>A photocurable and thermosetting resin composition comprising (A) an actinic radiation curable resin bearing one or more structures represented by the general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component: (1) wherein R1 is hydrogen or C¿1-6? alkyl; R?2, R3, and R4¿ are each hydrogen, C¿1-6? alkyl, aryl, aralkyl, cyano, fluoro, or furyl; and X is a polybasic acid anhydride residue.</p>
申请公布号 WO2002046840(P1) 申请公布日期 2002.06.13
申请号 JP2001010329 申请日期 2001.11.27
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