RESIN COMPOUND FOR FORMING INTERLAYER INSULATING LAYER OF PRINTED WIRING BOARD, RESIN SHEET AND COPPER FOIL WITH RESIN FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM

摘要

A resin compound for forming an interlayer insulating layer of a printed wiring board, characterized in that it comprises an epoxy resin containing as an epoxy resin curing agent having a nitrogen content of 5 to 25 wt % and a maleimide compound being curable with heat and contains no halogen elements. The resin compound can be used for producing a copper foil with a resin which is free of a halogen element and has high flame retardancy, and further exhibits excellent resistance to water and heat and good strength against peeling between the copper foil and a substrate.