Slide used for simultaneously removing material from both sides of semiconductor wafers between rotating plates comprises base body surface, surface of recess for receiving wafer, and surface of further recesses

摘要

A slide comprises 20% of a base body surface, 35% of a surface of a recess for receiving a wafer, and 12-30% of a surface of further recesses. An Independent claim is also included for a process for simultaneously removing material from both sides of semiconductor wafers. Preferred Features: The base body is made from a planar wave-free sheet steel. The recess for receiving the wafer is lined with a plastic ring having the same thickness as the base body.