发明名称 Elemental piece of flexible printed wiring board and flexible printed wiring board
摘要 A flexible printed wiring board constructed by using elemental pieces at a low cost. The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c. The connection among the elemental pieces 81a to 81c can be further enhanced by surface-roughing the supporting films 24a to 24c. <IMAGE>
申请公布号 EP1026929(A3) 申请公布日期 2002.06.12
申请号 EP20000102407 申请日期 2000.02.03
申请人 SONY CHEMICALS CORPORATION 发明人 KURITA, HIDEYUKI;TANIGUCHI, MASATO;HISHINUMA, HIROYUKI;NAKAMURA, MASAYUKI;NAMIKI, HIDETSUGU
分类号 H05K1/03;H01L21/60;H01L23/12;H05K1/14;H05K3/28;H05K3/40;H05K3/42;H05K3/46 主分类号 H05K1/03
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