Radiation curable resin composition, manufacturing process and article made using such a composition

摘要

The resin composition of this invention is a radiation curable resin composition used for manufacturing a fibrous material forming mold by laminate fabricating using selective irradiation with light. This resin composition contains a filler dispersed in a liquid constituent comprising at least an ethylenically unsaturated monomer and a photoinitiator. The liquid constituent preferably additionnally comprises a cationic polymerizable organic compound. Preferably the filler is an inorganic filler, and it can be surface-treated with a silane. Preferably the ethylenically unsaturated monomer comprises at least a polyfunctional monomer having three or more acrylate functions. Preferably the cationic polymerizable organic compound is composed of 50% or more of an epoxy containing compound.