| 摘要 |
PURPOSE: A semiconductor package is provided to prevent a sealing material from flowing to a device receiving space through an air exhausting hole, by forming a narrow outlet as compared with the inlet of the air exhausting hole and by performing an encapsulation while the outlet of the air exhausting hole is stopped up by the sealing material. CONSTITUTION: A central processing unit(CPU) chip is attached to the upper surface of a substrate. The substrate has the upper surface and a lower surface opposite to the upper surface. Outside connection terminals are electrically connected to the CPU chip, formed on the lower surface of the substrate. A lid(240) is attached to the upper surface of the substrate outside the CPU chip. The device receiving space is formed inside the lid to include the CPU chip. The air exhausting hole(246) is formed in the lid, penetrating the lid outside the CPU chip. A sealing unit(257) seals the air exhausting hole. The inlet of the air exhausting hole formed on the upper surface of the lid is smaller than the outlet of the air exhausting hole formed on the lower surface of the lid. The sealing unit includes a sealing body(259) and a sealing material(258). The sealing body stops up the outlet of the air exhausting hole, inserted into the air exhausting hole. The sealing material stops up the air exhausting hole.
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