Device and method for gripping and transporting wafers

摘要

A pivoting grab (7) has two cranked arms (10) at the end of which are vacuum suction operated pick-up devices (12). After semiconductor wafers are moved by a robot arm to a first depositing point (8) the grab transfers them to a processing station (3) and on completion to a second depositing point (9) for onward transport. The arms are at an angle a to one another which is greater than 900 but less than 1800.