Method of fabricating soldering balls for semiconductor encapsulation,申请号GB20000030160-传众专利搜索

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发明名称	Method of fabricating soldering balls for semiconductor encapsulation
摘要
申请公布号	GB2369830(A)	申请公布日期	2002.06.12
申请号	GB20000030160	申请日期	2000.12.11
申请人	TAO-KUANG * CHANG	发明人	TAO-KUANG * CHANG
分类号	B22F1/00;B22F9/08;B23K35/02;(IPC1-7):B22F9/08	主分类号	B22F1/00
代理机构		代理人
主权项
地址

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