发明名称 MOLD DEVICE FOR MOUNTING OF EMBOSS CARRIER TAPE
摘要 PURPOSE: A mold device for mounting of an emboss carrier tape is provided to perform mounting work of a mold electric part of the emboss carrier tape efficiently. CONSTITUTION: A mold device for mounting and sticking of an emboss carrier tape consists of a heating apparatus(110) heating and softening a mold part on carrier route as transferring thermoplastic tape(10) continuously; a mold apparatus(130) forming an emboss as arranging the heated part to a metal mold(132); a processing apparatus of hole(150) forming a guide hole in a fixed interval in the side of the thermoplastic tape; an inserting stage of product(210) installing a product(20) to a recessed part(12); a feeding apparatus of a cover tape(230) supplying a cover tape(30) in the upper face of the recessed part formed the emboss of the thermoplastic tape; a mounting apparatus(250) putting the cover tape on a circumference of the recessed part and mounting to the thermoplastic tape. The emboss carrier tape having the finished product is used by winding to a reel.
申请公布号 KR20020043774(A) 申请公布日期 2002.06.12
申请号 KR20000072890 申请日期 2000.12.04
申请人 KIM, YOUNG JOON 发明人 KIM, YOUNG JOON
分类号 B65B15/04;(IPC1-7):B65B15/04 主分类号 B65B15/04
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