| 摘要 |
PURPOSE: A double die package using a lead frame is provided to make the active surfaces of upper and lower chips in the same direction, by mounting the lower chip on the lower surface of a die pad while using adhesive tape for a lead on chip(LOC) and by interposing adhesive to mount the upper chip on the upper surface of the die pad. CONSTITUTION: Semiconductor chips are mounted on the die pad(212). Leads(214) are disposed with respect to the die pad. The lead frame(210) includes the die pad and the leads. The lower chip has an active surface having edge pads. A part of the active surface except the edge pads is attached to the lower surface of the die pad. The upper chip(220) has an active surface having bonding pads(242). The opposite surface to the active surface is attached to the upper surface of the die pad. The bonding pads of the upper chip and the edge pads of the lower chip are electrically connected to the leads of the lead frame by bonding wires(230,250). Molding resin(260) encapsulates a region including the upper/lower chips, the die pads, the bonding wires and a part of the leads. |
