| 摘要 |
Laminate structures, for example for use in circuit boards, comprise a metal foil and at least one cured composition layer disposed on at least one surface of the metal foil, wherein the cured composition layer comprises (a) at least one compound selected from the group consisting of cyanate esters and cyanate ester prepolymers, (b) a flame retardant which is substantially toluene soluble and substantially free of hydroxy residues in the cured state, and (c) a curing catalyst.
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