| 发明名称 |
Circuit board and a method for making the same |
| 摘要 |
A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
|
| 申请公布号 |
US6403893(B2) |
申请公布日期 |
2002.06.11 |
| 申请号 |
US20010907971 |
申请日期 |
2001.03.20 |
| 申请人 |
VISTEON GLOBAL TECHNOLOGIES, INC. |
发明人 |
ACHARI ACHYUTA;GLOVATSKY ANDREW ZACHARY;BELKE ROBERT EDWARD;NATION BRENDA JOYCE;LI DELIN;GOENKA LAKHI N.;GORDON ROBERT JOSEPH;KRAUTHEIM THOMAS BERND |
| 分类号 |
H05K3/00;H05K3/06;H05K3/40;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H05K1/14 |
主分类号 |
H05K3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
