发明名称 |
Die-to-insert permanent connection and method of forming |
摘要 |
The invention disclosed herein is a semiconductor die assembly and method of making the same having a die and insert substrate that are electrically interconnected by diffusing gold bumps attached to the connecting surface of the substrate to aluminum-based bond pads on the die to form a permanent die-to-insert connection. The process for diffusing the gold bumps into the bond pads preferably occurs during a burn-in process wherein pressure and heat are applied to the die/substrate assembly without melting the gold bumps until a permanent die-to-insert substrate connection is properly made.
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申请公布号 |
US6404063(B2) |
申请公布日期 |
2002.06.11 |
申请号 |
US20010915236 |
申请日期 |
2001.07.25 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FARNWORTH WARREN M.;WOOD ALAN G. |
分类号 |
H01L23/32;H01L23/433;H01L23/48;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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