ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CONNECTING CIRCUIT, CONNECTED UNIT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive composition capable of preventing corrosion of an adherend composed of a metal and an inorganic material and accompanying decrease in reliability of an element, the adhesive composition for connecting a circuit, to provide a connected unit and a semiconductor device. SOLUTION: The adhesive composition comprises (a) a curable adhesive curable by photo-irradiation at 150-750 nm, or heating at 80-200 deg.C, or a combination of photo-irradiation and heating, (b) electroconductive particles and (c) a compound bearing at least one benzotriazole structure in the molecule.