| 摘要 |
PROBLEM TO BE SOLVED: To provide an LT wafer whose mechanical strength is improved in cracking and chipping and a yield during a mechanical process and a device process is enhanced, and its edging method. SOLUTION: A side 1c of an wafer 1 consisting of a lithium tantalate single crystal is so edged that its cleavage face of >=20% is contained, especially arithmetic mean-surface roughness (Ra) is <=1μm.
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