发明名称 POLYIMIDE RESIN COMPOSITION AND FILM-SHAPED ADHESIVE AGENT
摘要 PROBLEM TO BE SOLVED: To obtain a film-shaped adhesive agent which is excellent in heat resistance as the property of a thermoplastic polyimide resin as well as adhesiveness to metal, a laminated sheet and a printed circuit board, and can be heated to press without bubbling foams. SOLUTION: The film-shaped adhesive agent comprises a polyimide resin of a specific structure, an epoxy compound, and a compound linkable with the epoxy compound to form a silane coupling.
申请公布号 JP2002167508(A) 申请公布日期 2002.06.11
申请号 JP20000366221 申请日期 2000.11.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 YASUDA HIROYUKI;YAMAMORI YOSHIYUKI;DAITO NORIYUKI
分类号 C08L79/08;C08G73/10;C08K5/54;C08K5/541;C08L63/00;C09J7/00;C09J7/02;C09J163/00;C09J179/08;C09J183/04;(IPC1-7):C08L79/08 主分类号 C08L79/08
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