发明名称 |
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
摘要 |
Planarizing solutions, planarizing machines and methods for planarizing microelectronic-device substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. In one aspect of the invention, a microelectronic-device substrate assembly is planarized by abrading material from the substrate assembly using a plurality of first abrasive particles and removing material from the substrate assembly using a plurality second abrasive particles. The first abrasive particles have a first planarizing attribute, and the second abrasive particles have a second planarizing attribute. The first and second planarizing attributes are different from one another to preferably selectively remove topographical features from substrate assembly and/or selectively remove different types of material at the substrate surface.
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申请公布号 |
US6402884(B1) |
申请公布日期 |
2002.06.11 |
申请号 |
US20000706504 |
申请日期 |
2000.11.02 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
ROBINSON KARL M.;MEIKLE SCOTT G. |
分类号 |
B24B37/04;B24B57/02;H01L21/321;H01L21/768;(IPC1-7):C23F1/02 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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