| 摘要 |
In a structure for connecting terminals on wiring boards, lands on a wiring board are respectively connected with lead terminals on another wiring board through solder. Outline of each land has a bump and a recess respectively on edges facing to terminal arranging direction. Meanwhile the lead terminals are rectangular. In plan view, the recess protrudes from an edge of respective lead terminal while protrusions on ends of the recess protrude from another edge of the respective lead terminal. Even when position of the each land to the respective lead terminal deviates not so excessively, the bump and the protrusion protrude from outline of the lead terminal. Thus, on each of such protruding portions, visible fillets of the solder are formed.
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