Semiconductor chip, semiconductor wafer, semiconductor device and method of manufacturing the semiconductor device

摘要

An object of the present invention is forming a concave portion (including a penetration hole) in a semiconductor substrate by a sandblast method without causing a defect such as a chip or a crack in processing ends of the concave portion. In order to achieve the object, in a semiconductor wafer in which a plurality of semiconductor chips are formed, a metal film is formed on the semiconductor substrate at least in a region of a predetermined range in an inside and an outside of an circumferential portion except for a central portion and its vicinity of a region in that the concave portion (including the penetration hole) of the respective semiconductor chips is to be formed. Then, the entire surface of the semiconductor wafer including the metal film is masked except for the region in that the concave portion of the respective semiconductor chips is to be formed. With this state, the concave portion is formed in the respective semiconductor chips formed on the semiconductor wafer by the sandblast method.