发明名称 |
Semiconductor package and its manufacturing method |
摘要 |
A semiconductor package having a structure in which the surface of a semiconductor chip (30) is protected with a resin film (12) having a conductor wiring layer (11) and a method for manufacturing the semiconductor package. The surface of the semiconductor chip (30) and the resin film (12) are directly jointed by fusing the resin film (12), and a part of the conductor wiring layer (11) is connected with the electrode portion of the semiconductor chip (30) and another part of the conductor wiring layer (11) is exposed outside as an external terminal. The semiconductor package is highly reliable and excellent although it has a wireless/fine pitch and an extremely small thickness. |
申请公布号 |
AU2104102(A) |
申请公布日期 |
2002.06.11 |
申请号 |
AU20020021041 |
申请日期 |
2001.11.26 |
申请人 |
KANEBO LIMITED;KANEBO MICROELECTRONICS, LIMITED |
发明人 |
YASUNORI NAGATA;HIDEKI ONODA;MITSURU NAGAI;SHIGEYUKI SETODA;KENZO HATADA;KOICHIRO MORIMOTO |
分类号 |
H01L23/29;H01L21/60;H01L23/31;H01L23/495;H01L23/50;H01L25/10 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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