发明名称 |
METHOD AND APPARATUS FOR ELECTROLYTIC PLATING OF SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and a apparatus for electrolytic plating of a substrate in which copper can be imbedded in a fine wiring pattern by using plating solution of high uniform electrodeposition property and high leveling property, the plating film thickness is substantially equal for both a wiring part and a non-wiring part, and CMP is easy. SOLUTION: A space 99 formed of the substrate W and an anode 98 disposed close to and substantially parallel to the substrate W is filled with plating solution containing metal ion and additives, and the concentration of the additive in the plating solution in the plating space 99 is changed during the plating operation.
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申请公布号 |
JP2002167693(A) |
申请公布日期 |
2002.06.11 |
申请号 |
JP20010248125 |
申请日期 |
2001.08.17 |
申请人 |
EBARA CORP;TOSHIBA CORP |
发明人 |
MISHIMA KOJI;INOUE HIROAKI;MAKINO NATSUKI;KUNISAWA JUNJI;NAKAMURA KENJI;MATSUDA TETSURO;KANEKO HISAFUMI;MORITA TOSHIYUKI |
分类号 |
C25D7/12;C25D5/10;C25D17/00;C25D21/00;C25D21/02;C25D21/14;H01L21/288;(IPC1-7):C25D7/12 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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