发明名称 POLYAMIDE RESIN COMPOSITION AND PLASTIC MULTILAYER BODY
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide resin composition that can firmly adhere to a fluororesin, and causes no or few problems such as over-reaction, at the adhesion interface when multilayer composites are formed from the fluororesin and the polyamide resin. SOLUTION: The polyamide resin composition comprises (A) a polyamide wherein the molar ratio of the carboxyl end group to the amino end group is >1, (B) an aminocarboxylic acid having a molecular weight of <=15,000, and (C) a base having a pKa (25 deg.C) of >=10 or a salt thereof. The relative viscosity of the polyamide (A) is, for example, on the level of 1.9-2.7 (in 0.5 wt.% m-cresol solution at 25 deg.C). The aminocarboxylic acid (B) comprises (B1) a polyamide having a number average molecular weight of 200-15,000, (B2) an aliphatic aminocarboxylic acid, or the like. A cyclic amine and a salt thereof are the examples that can be used as the base or salt thereof (C).
申请公布号 JP2002167505(A) 申请公布日期 2002.06.11
申请号 JP20000366818 申请日期 2000.12.01
申请人 DAICEL DEGUSSA LTD 发明人 ARITA HIROAKI;SHIMIZU TAKUMI
分类号 B32B27/00;B32B27/18;B32B27/30;B32B27/34;C08K5/00;C08K5/17;C08L77/00;C08L77/02;C08L77/06;(IPC1-7):C08L77/00 主分类号 B32B27/00
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