发明名称 |
Apparatus and method for a reliable return current path for sputtering processes |
摘要 |
A method for establishing and maintaining a reliable ground for reactive sputtering systems. A spatially extended high density plasma is generated in a large region surrounding the sputtering target. The plasma electrically connects the target to a part of the coating machine that is not subject to deposition of sputtered material from the target. The plasma is generated by an applicator which is independent of the target.
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申请公布号 |
US6402902(B1) |
申请公布日期 |
2002.06.11 |
申请号 |
US19950388191 |
申请日期 |
1995.02.13 |
申请人 |
DEPOSITION SCIENCES, INC. |
发明人 |
BOLING NORMAN L. |
分类号 |
H05H1/46;C23C14/00;C23C14/34;C23C14/54;H01J37/32;H01J37/34;(IPC1-7):C23C14/34 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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