| 摘要 |
PROBLEM TO BE SOLVED: To provide metallic foil which has excellent adhesiveness with a resin material, and, when used as foil for the circuit pattern of a substrate for a circuit board, enables the formation of etching of a fine circuit pattern. SOLUTION: The metallic foil consists of a foil body 1 which is an electrolytic copper foil in which grains with the average grains size of <=2μm appear particularly on the surface and a texture of fine particles 2 adhered to one side or both sides of the foil body 1 by electroplating. The fine particles have the average particle size of <=1μm. Further, the fine particles are alloy particles consisting of Cu and at least one kind of element (I) selected from the group consisting of Ni, Co, Fe and Cr, or are mixture of the above alloy particles and the oxide particles of at least one kind of element (II) selected from the group consisting of V, Mo and W. The coating weight of the above elements (I) in the above fine particles is 0.1 to 3 mg/dm2 per 1 mg/dm2 of the coating weight of Cu. Further, the coating weight of the above elements (II) in the above mixture is 0.02 to 0.8 mg/dm2 per 1 mg/dm2 of the coating weight of Cu.
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