MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATION FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE USING THEM

摘要

PROBLEM TO BE SOLVED: To obtain a material for an insulating film excellent in electric properties, thermal properties, mechanical properties, and also capable of giving a low dielectric constant, a coating varnish for the insulating film containing the same, and to prepare the insulating film and to provide a semiconductor device both using them. SOLUTION: The material for the insulating film contains, as a film forming compound, a copolymer produced by reacting a polyamide having a specific structure with a reactive oligomer, the coating varnish comprises the material and a solvent, the insulating film has a resin layer comprising, as a main structural component, a polybenzoxazole produced by thermally condensing and crosslinking the material and the coating varnish and contains also micropores therein, and the film is used for an interlayer insulating film for a multilayer interconnection and/or a semiconductor device having a surface-protection layer.