发明名称 |
Method for fabricating storage capacitor using high dielectric constant material |
摘要 |
A method for manufacturing a semiconductor device by laminating a plurality of ruthenium-type conductive electrodes and a dielectric film having a perovskite structure, includes forming a first conductive electrode at the semiconductor substrate, forming a first area where elements constituting the first conductive electrodes and elements constituting a first dielectric film are melded, forming a transitional layer by performing a heat treatment on the first meld area within a non-oxidizing atmosphere and forming the first dielectric film on the first conductive electrode. Accordingly, a transitional layer having a consistent composition can be formed with a high degree of efficiency at the interface of the ruthenium-type electrode and the dielectric substance having a perovskite structure, so that a capacitor structure employing a very thin dielectric film having a high dielectric constant can be produced with ease and at low cost.
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申请公布号 |
US6403441(B1) |
申请公布日期 |
2002.06.11 |
申请号 |
US19990291306 |
申请日期 |
1999.04.15 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TAKEHIRO SHINOBU;YOSHIMARU MASAKI |
分类号 |
H01L27/108;H01L21/02;H01L21/8242;H01L21/8246;H01L27/105;(IPC1-7):H01L21/20;H01L29/76;H01L29/94 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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