发明名称 Method for fabricating storage capacitor using high dielectric constant material
摘要 A method for manufacturing a semiconductor device by laminating a plurality of ruthenium-type conductive electrodes and a dielectric film having a perovskite structure, includes forming a first conductive electrode at the semiconductor substrate, forming a first area where elements constituting the first conductive electrodes and elements constituting a first dielectric film are melded, forming a transitional layer by performing a heat treatment on the first meld area within a non-oxidizing atmosphere and forming the first dielectric film on the first conductive electrode. Accordingly, a transitional layer having a consistent composition can be formed with a high degree of efficiency at the interface of the ruthenium-type electrode and the dielectric substance having a perovskite structure, so that a capacitor structure employing a very thin dielectric film having a high dielectric constant can be produced with ease and at low cost.
申请公布号 US6403441(B1) 申请公布日期 2002.06.11
申请号 US19990291306 申请日期 1999.04.15
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 TAKEHIRO SHINOBU;YOSHIMARU MASAKI
分类号 H01L27/108;H01L21/02;H01L21/8242;H01L21/8246;H01L27/105;(IPC1-7):H01L21/20;H01L29/76;H01L29/94 主分类号 H01L27/108
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