发明名称 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
摘要 An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.
申请公布号 US2002068173(A1) 申请公布日期 2002.06.06
申请号 US20010973719 申请日期 2001.10.11
申请人 HITACHI CHEMICAL CO., TLD 发明人 TAKANO NOZOMU;FUKUDA TOMIO;MIYATAKE MASATO
分类号 C08K3/22;B32B15/08;C08K9/06;C08K13/02;H01L23/14;H01L23/29;H05K1/03;(IPC1-7):B32B27/38;C08F8/00 主分类号 C08K3/22
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