发明名称 |
Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board |
摘要 |
An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.
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申请公布号 |
US2002068173(A1) |
申请公布日期 |
2002.06.06 |
申请号 |
US20010973719 |
申请日期 |
2001.10.11 |
申请人 |
HITACHI CHEMICAL CO., TLD |
发明人 |
TAKANO NOZOMU;FUKUDA TOMIO;MIYATAKE MASATO |
分类号 |
C08K3/22;B32B15/08;C08K9/06;C08K13/02;H01L23/14;H01L23/29;H05K1/03;(IPC1-7):B32B27/38;C08F8/00 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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