| 摘要 |
The present invention discloses a semiconductor wafer baking apparatus comprising a heating plate, a wafer guide, and an exhaust heat compensator. The heating plate is loaded with a wafer and the wafer guide arranges the wafer on the heating plate. The exhaust heat compensator is placed on the wafer guide and compensates exhausted heat from an edge area of the wafer. The exhaust heat compensator comprises a penetration hole to expose a center portion of the wafer. Therefore, the semiconductor wafer baking apparatus according to the present invention compensates the heat loss occurring in the edge area of the wafer and keeps the edge area of the wafer from temperature drop, which results in a temperature uniformity on the wafer surface. By reducing the temperature deviation within a wafer, a uniform pattern size of an entire wafer in the semiconductor wafer manufacturing process is achieved so that the process reliability and the process yields can be improved.
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