发明名称 Method of manufacturing flash memory
摘要 The present invention forms a protection layer of doped amorphous silicon or amorphous silicon on a semiconductor substrate in which a control gate is formed in a stack structure of doped poly Si and etches only a given portion of the protection layer in a subsequent process to form a contact hole. Therefore, the present invention can prevent oxidization of a given portion of WSix due to exposed WSix.
申请公布号 US2002068439(A1) 申请公布日期 2002.06.06
申请号 US20010998339 申请日期 2001.12.03
申请人 HYNIX SEMICONDUCTOR INC. 发明人 DONG CHA DEOK;PARK SANG WOOK;PARK SE HO
分类号 H01L27/115;H01L21/336;H01L21/4763;H01L21/768;H01L21/8247;H01L29/788;(IPC1-7):H01L21/476 主分类号 H01L27/115
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