| 摘要 |
<p>A semiconductor device lead inspection apparatus by capturing images of the semiconductor (44) edges and leads (46) along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. One image is a direct backlit image of the device. A second image taken along a direction corresponding to a second optical axis (50) is reflected into a direction (52) corresponding to the first optical axis (42). By forming two images it is possible to locate the leads of the semiconductor device in three dimensions.</p> |
