Production of a micromechanical structure used for integrated sensor arrays comprises applying an auxiliary layer and a membrane to a substrate to cover contact surfaces
摘要
Production of a micromechanical structure comprises preparing a substrate (1) having evaluation electronics or their components and provided with contact surfaces (2); applying an auxiliary layer (4) and a membrane (5) as a layer sequence to the substrate to cover the contact surfaces; inserting metal structures (6a) into the auxiliary layer so that they touch the contact surfaces; and selectively etching the auxiliary layer. An Independent claim is also included for the micromechanical structure produced. Preferred Features: A passivating layer (3) is applied to the substrate before the auxiliary layer is applied. A contact hole (5a) is etched through the layer sequence. The metal structures are made from tungsten.
申请公布号
DE10058864(A1)
申请公布日期
2002.06.06
申请号
DE2000158864
申请日期
2000.11.27
申请人
SIEMENS AG;INFINEON TECHNOLOGIES AG
发明人
RAINER, DR.;KOLB, STEFAN;PITZER, DANA;PRIMIG, ROBERT;SCHREITER, MATTHIAS;WINKLER, BERNHARD