The invention concerns an integrated circuit chip device comprising a support (14) having a global plane (15) wherein emerges an edge (19) of a cavity (16), a communication interface (13) with antenna and/or contact pads borne by said plane, at least an integrated circuit chip (11) arranged in said cavity with its active surface facing outwards and connected to said interface by interconnecting elements (9), said chip having an active surface (20) provided with connection pins (21) and delimited by a peripheral ridge (24). The invention is characterised in that said chip peripheral ridge (24) is spaced away from said cavity edge (19) and each interconnecting element consists of a continuous bead (9) of electrically conductive material extending from the chip pins (21) up to the support plane. The invention also concerns a method for making said device.
