The joint compound of the present invention utilizes hollow resin microspher es with a mean particle size less than 75 microns and exhibiting no more than 1 .5 % increase in density under high shear stress testing.
申请公布号
CA2396125(A1)
申请公布日期
2002.06.06
申请号
CA20012396125
申请日期
2001.11.16
申请人
UNITES STATES GYPSUM COMPANY
发明人
CIMAGLIO, SCOTT A.;PICKLES, DAVID MARTIN;IMMORDINO, SALVATORE C., JR.;MILLER, CHARLES J.
