发明名称 |
Flip chip in leaded molded package with two dies |
摘要 |
A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second die is coupled to a second side of the leadframe with solder. A molded body surrounds at least a portion of the leadframe and the dies.
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申请公布号 |
US2002066950(A1) |
申请公布日期 |
2002.06.06 |
申请号 |
US20000730932 |
申请日期 |
2000.12.04 |
申请人 |
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发明人 |
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分类号 |
H01L21/60;H01L23/31;H01L23/485;H01L23/495;(IPC1-7):H01L23/02;H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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