PROTECTIVE COVER AND ATTACHMENT METHOD FOR MOISTURE SENSITIVE DEVICES

摘要

A radiation imaging device (20) includes a scintillator (26), a cover (22) and an imager substrate (28). A photodetector array (30) comprising a plurality of photodetectors (32) is disposed on the imager substrate (28). The cover (22) is hermetically bonded to the substrate (28) with a sealant (24). The cover has outer sidewalls (42, 44) and a top side (46) connecting the outer sidewalls. In attaching to the substrate, the cover is disposed on the imager substrate to surround the scintillor. A curable sealant is applied along the outer surface of the cover. The sealant is then cured to hermetically bond the cover to the substrate.