发明名称 PHOTOCURABLE SEALING MATERIAL COMPOSITION
摘要 <p>A photoreaction-curable sealing material composition which is reduced in odor emission during the production, application, and curing of the product and which after curing is highly flexible at low temperatures. It comprises a (meth)acrylate monomer having a phenyl group having a molecular weight of 200 or higher, hydrophobic silica, and a photoreaction initiator.</p>
申请公布号 WO2002044298(P1) 申请公布日期 2002.06.06
申请号 JP2000008532 申请日期 2000.12.01
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