发明名称 |
Bonding apparatus and bonding tool for component |
摘要 |
In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.
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申请公布号 |
US2002066767(A1) |
申请公布日期 |
2002.06.06 |
申请号 |
US20010899356 |
申请日期 |
2001.07.05 |
申请人 |
TAKAHASHI SEIJI;OTAKE KENICHI;ISHIKAWA TAKATOSHI;OKAZAKI MAKOTO |
发明人 |
TAKAHASHI SEIJI;OTAKE KENICHI;ISHIKAWA TAKATOSHI;OKAZAKI MAKOTO |
分类号 |
B06B1/02;B23K20/10;H01L21/60;H01L21/607;H05K3/32;(IPC1-7):B23K1/06;B23K5/20 |
主分类号 |
B06B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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