| 摘要 |
A wood composite board or panel, such as particleboard, fiberboard, oriented strand board or waferboard and a method of producing the same. The composite board or panel comprises a plurality of wood pieces, thermoset resin to bind the wood pieces and a filler having a high thermal conductivity. Examples of such a filler include natural and synthetic graphites, metal, carbon, silicon carbide and other similar compounds and their mixtures.
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