INTERPOSER FOR A SEMICONDUCTOR MODULE, SEMICONDUCTOR PRODUCED USING SUCH AN INTERPOSER AND METHOD FOR PRODUCING SUCH AN INTERPOSER

摘要

The invention relates to an interposer for a semiconductor module that consists of a carrier base (10) in the form of a film on whose upper face a semiconductor component (2) and its component interconnectors (21) are directly applied. From the lower face of the carrier base (10) throughbores (11) are introduced in such a manner that the component interconnectors (21) of the semiconductor component are exposed. The throughbores are contacted with the component interconnectors of the semiconductor component by way of a metallized layer (12, 22). The walls of the throughbores (11) are then exposed from the lower face of the support base by annular notches (14) so that chimney-shaped, recessed studs (15) are produced that form the external connections for the module for providing the contacts on a printed circuit board.